ADLINK's 3D Equidistant Spiral Motion Solution
Reduces Material Costs and Increases Yield of the Silver Dip Process
The traditional vertical silver dip procedure can result in the sub-optimal application of silver paste, such as general unevenness, half-moon shape, and thick center with thin edges. Besides the waste of silver paste, there are other pressing concerns. Components with rough surfaces or unusual shapes are especially prone to gaps between the component’s surface and the silver paste when using this technique. After the baking process is complete, these gaps have a detrimental impact on the components’ electrical performance.