Let's Shape the Future of Semiconductor Packaging and Testing

Let's Shape the Future of Semiconductor Packaging and Testing

The semiconductor industry has been booming in recent years which is expected to reach a healthy CAGR of over 6% by 2026, however, with the continuous miniaturization of the semiconductor manufacturing process, chip designs are becoming lighter, thinner, and have three-dimensional heterogeneous integration, with the process inevitably moving toward having higher precision and high speed to further enhance manufacturing productivity. 

ADLINK's Semiconductor Packaging and Testing Solution integrated machine vision and motion control system with PC-based, overcomes the challenges encountered by the semiconductor industry. Contact our experts to get more solution information.

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