With Its Powerful Die Bond Solution, ADLINK Helps Semiconductor Factories Accelerate Their Back-end Packaging Process

The semiconductor chip industry has been booming in recent years primarily due to the wide extent of applications in trending fields such as electric vehicles, 5G , military hardware, and low-orbit satellites, for example; essentially, everything is driven by chips.

ADLINK Technology has been developing die bond solutions for many years, witnessing the evolution of the semiconductor process as well as the operating pain points arising from the changes. In keeping pace with the times, ADLINK has introduced an advanced die bond solution that operates faster, achieves more accurate positioning, and allows easier setting, helping customers in the semiconductor industry resolve the issues they encounter.