Technological Break-through for Semiconductor Laser Dicing

A smaller process can put more computing units in the same space, resulting in better performance, less heat generation, and more power savings. Due to the miniaturization of the semiconductor manufacturing process, the packaging and testing process is a vital stage, especially the accuracy of the wafer dicing technology. ADLINK' laser dicing solution integrating visual alignment and motion control which not only resolve the problem but also improve the efficiency of laser dicing